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Manufacturing Process of Ceramic PCBs, Substrates
BHOSCH Electronics Applied Technology (BEAT) has set up the modern the facilities for manufacturing the ceramic substrate PCBs and different types packages. We can support low-medium- and large quantities ceramic PCBs, assembly of dice, wire bonding, metal packages and epoxy encapsulations. We can make custom ceramic PCBs and packages of any design as per customer requirement.
BEAT is founded and Managed by expert in the field of Electronics packaging Having more than 30 years of experience.
Our Process
